SAPlate (焊接用铝板) Solderable Aluminum Sheets (SAPlate).DOC

SAPlate (焊接用铝板) Solderable Aluminum Sheets (SAPlate) 焊接用铝板是我公司多年来采用表面加工技术制成的新材料，适用于不易进行表面加工的铝制材料。镍和锡镀上铝制表面，具备可焊性和卓越的传导性。本材料用作散热材料时，可减小制造工艺，大幅减轻产品重量。SAPlate is a new materials uses surface process technology cultivated over many years by our company for aluminum materials which are difficult to surface process.?Nickel and tin are plated to an aluminum surface possessing solderability and superb conductivity.?Manufacturing processes can be eliminated and a much more lightweight item can be achieved by using these materials for the exoergic materials. ?用途散热材料。 作为散热材料，与传统相比，重量大大减轻。 通过弯曲工序，实现简化的装配过程。Exoergic Materials No need for pinning process like with conventional aluminum extruded materials. E ables direct soldering. Enables large weight reductions compared to conventional products as exoergic materials. Enables a simplified assembly process through sheet bending process. 下图为使用普通铝型材时的LED灯具结构图，由图可见，热量从LED传递到散热器，至少需要通过金属散热块，焊料，铝基板，导热胶四部分才能最终到达散热器，且各部分热阻都不相同，因此大大制约了热量的传递，这是最终导致LED散热不能很好解决的根本原因。 使用我公司所开发的可焊接铝板，便可以直接将LED焊接到铝散热器上，这里面减少了四道热阻，所以大大的提升了LED的散热效果，同时也就提升了LED的寿命。 特点 我们开发焊铝板，它能大幅度减轻散热材料的重量。 实现铝焊接。 通过特殊的铝板表面加工实现了可焊接性。 保留基底材料铝的特性。 铝的轻质、高热导性和高导电性得以保留。 环保型 不使用对环境有害的物质。Features We developed the soldering aluminum sheet that realizes the great weight saving of exoergic materials. Enables soldering to aluminum. Enables soldering by specially processing aluminum sheet surface. Base material aluminum characteristics are retained. Lightweight, high heat conductivity and high electric conductivity characteristics of aluminum are retained. Eco-friendly No environmentally harmful substances are used. 特性 焊接特性 流体焊接和回流焊接均能实现与铜和锡相同的焊料润湿性。 润湿性增高比率(%)回流焊接润湿性增高 散热性 以三分之一的重量实现与挤压材料相同的散热性。 半导体温度(摄氏度) 植入到实际产品时的放热特征。 ?Characteristics Solder Characteristics Solder wettability equal to copper and tin is gained for both flow soldering and reflow soldering. Rate of wettability increase (%) Reflow soldering wettability increase Radiation Radiation equal to extru