劈刀选型 (Cap Design Considerations - Slide show).ppt

Capillary Design Considerations Choosing The right tool for your process Factors affecting capillary design Basic Terminology General Dimensions Wire Bonding Cycle The Capillary and the ball Bonding Process First Bond CD, Hole, IC Angle First Bond - 1st bond formation affected by: Tip, CD IC Volume V FAB = Vsquash + VCD + Vneck 90 Vs 120 Angle comparison IC Volume affects on different applications IC Volume is a function of : CD, H and ICA Effect of Inner Chamfer Angle - 900 vs. 1200 Hole diameter selection Hole selection for STD BTNK Caps Hole selection for FP UFP Caps Looping Looping - IC Type Double IC Looping - D/IC influence Looping - IR Type Inner Radius Chamfer Looping - IR influence Second Bond Comparison Second Bond Comparison IC Definition Tip effect on 2nd bond Capillary Features Surface Effects Matte Finish Vs. Polish Wear resist Capillaries TBR - Tail Bond Reinforce HD Capillary Side Cut Double Side Cut - HW Flicker Capillary Capillary Special packaging and coding This slide cut the 1st bond introduction and moves the show the Hole selection. The wire clearence is one of the important discussions in order to understand the life span of the Caps. In the slide are presented a list of wires diameters for STD Pitch ranges and the Recommended hole. In the slide are presented a list of wires diameters for FP UFP Pitch ranges and the Recommended hole. This slide is related to Second Bond. Hereby the Face Angle recommendations according to the Tip of the capillary. The transducer and the machine working platform set the limitation for capillary length. Hereby the KnS capillaries lengths This slide shows the range between all the capillary parameters according to the STD Families Pitch. This slide shows the range between all the capillary parameters according to the FP and UFP Families Pitch. At this stage the discussion wil