SMD零件包装方式（SMD parts packaging）.doc

SMD零件包装方式（SMD parts packaging） The first chapter is zero recognition and introduction Common SMD parts packaging methods: CHIP/MELF/TR/SOP (SOIC)/SOJ/PLCC/QFP/BGA. Resistance [R] [RN] [VR] CHIP = public system/British system. In Taiwan, the term is based on the English system, and the commonly used CHIP parts are shown in the following table: The part specification is long (L) width (W) thickness (T) REMARK 0402 (UK) / 1005 (public) 1.0mm 0.5mm 0.4mm 0.4mm 0603 (UK) / 1608 (public) 1.6 mm 0.8mm 0.4-1.0mm 0805 (British) / 2125 (public) 2.0 mm 1.25 mm 0.5-1.0 mm 1206 (British) / 3216 (male) 3.2 mm 1.6 mm 0.6-1.2 mm CHIP is divided into resistance and capacitance, and occasionally there are parts such as inductance/special specification. The general plane is called CHIP. A. Resistance is abbreviated [R] in PC, the resistor is called [RN], variable resistor is called [VR]. The error value of a1. R has J Type = + / -5% (commonly used) with 3 digits. F Type = + / -1% (precision) is displayed in 4 digits. J Type part appearance display = resistance value 000 = 1 Ω 100 = 10 Ω 101 = 100 Ω 102 = 1 k Ω 103 = 10 k Ω 104 = 100 k Ω 105 = 1 m Ω F Type part appearance display = resistance value 1 r2 = 1.2 Ω 1000 = 100 Ω 1001 = 1 k Ω 1002 = 10 k Ω 1003 = 100 k Ω 1004 = 1 m Ω The same appearance of RN and J Type shows a common specification of 1206 on the main board. RN of SMD has 8 points to eat tin, unlike 1206 having 2 points for tin. VR is used on communications products, and there are two thirds of them. B. Common resistance specifications of MAIN BOARD 0603/0805/rn... C. Communication products have high frequency relations, common resistance specifications 0603/1608 / VR, but they will appear in the majority in F Type. D. The trend of the parts is gradually replaced by 0603, the main LAYOUT and the density of the machine board (Notebook), the pressure characteristics of the materials and the accuracy of the solder paste and the steel plate have been overcome, and the following