Al_Cu合金等温凝固的相场法模拟_刘小刚.pdf

2002 6 铸 造 设 备 研 究 2002 　12 RESEARCH STUDIES ON FOUNDRY EQUIPMENT Dec.2002　№6 ·· Al-Cu , , (沈阳工业学院, 辽宁 沈阳110016) 　　　:采用相场与浓度场耦合的相场法对Al-Cu 二元合金等温凝固中的枝晶长 过程进行了二维数 值模拟。在模拟中, 研究了搅动及不同的过冷度对枝晶生长形貌的影响, 并对相场和浓度场作了对比和分析。 在数值计算过程中, 利用薄的界面限制条件获得了相关的相场参数, 计算采用均匀网格 一般显式有限差分法。 计算结果显示出与实践经验相一致的各种凝固特征。 　　:合金;等温凝固;相场法 + 　　:　TG244 .3　　:A　　:1004-6178(2002)06-001 -04 Numerical Simulation of Al-Cu Alloy Isothermal Dendritic Growth by Phase-field Model LI UX iao-gang , WANG Cheng-zhi , M O Chun-li (Shenyang Institute of Technology , Shenyang 110016 , China) 　　Abstract:The phase-field model which coupled the concentration field and phase field is applied to simulate microstructural evolution during isothermal dendritic growth of Al-Cu binary in 2-D.In simulation, studied the noise and different surperfluoustemperature how to af- fect the growth of dendritic and compared phase-field figure with concentration field figure.The parameters of phase-field equation are de- termined by a thin interface limit condition.The phase-field model equations have been solved using the explicit finite difference method on an uniform mesh.The calculated results show various solidification features consistent with our experience. 　　Key words:alloy;isothermal solidification;phase-field method [ ] 　　 ; [6] 。 。 , , , , , 。 。, Al-Cu , [7] , 。 , , 1　 [1,2] 1.1　控制方程 。 , [8]