HeatSinkDesign散热槽设计实例.pdf

EXAMPLE 6.2-3: Heat Sink Design You are designing a passive heat sink for an electronic component. Plates of copper with thickness th = 1.5 mm extend between two parallel surfaces, as shown in Figure 1. The space c between adjacent plates forms an open channel. The copper is sufficiently conductive that these plates can be assumed to be isothermal. (This assumption could be confirmed by computing the fin efficiency of the plates.) The copper plates, and therefore the channels, are L = 25 cm long in the direction of gravity. The surfaces are W = 10 cm wide and separated by a distance H = 10 cm. W = 10 cm =° T∞ 20 C H = 10 cm copper plates g ° T 80 C s th = 1.5 mm c p L = 25 cm Figure 1: A heat sink fabricated using copper plates that extend between heated surfaces. The heat sink is placed in stagnant air at a nominal temperature of T∞ = 20°C and the plates are maintained at a temperature of T = 80°C. s a.) Determine the plate-to-plate pitch (p in Figure 1) that maximizes t