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怎样设定锡膏回流温度曲线txt(How to set reflow temperature curve of solder paste TXT)
怎样设定锡膏回流温度曲线txt(How to set reflow temperature curve of solder paste TXT)
Setting and measurement of reflow temperature curve of solder paste
Abstract: reflow soldering is a unique process in Surface Mount Technology (SMT). This paper mainly introduces the method of setting reflow temperature curve and measuring method of reflow temperature curve.
Key words: temperature curve, reflow soldering, temperature zone
Introduction:
Since 80s, electronic products have been developing at an alarming rate towards light, short and high performance. In this process, the widespread application of Surface Mount Technology (SMT) has played a key role. At present, the quality of the reflow soldering technology is critical for the quality and reliability of the final product in the presence of poor printing and placement equipment and technology. Therefore, it is an important link to study the reflow process and develop a reasonable reflow temperature curve to ensure the quality of surface assembly.
Development of reflow soldering equipment
In the electronics industry, a large number of surface assembly components (SMA) are welded by reflow soldering. At present, the types of reflow soldering equipment are divided into three types: infrared, full blast and infrared heating.
Infrared ray: infrared reflow soldering is to achieve the welding of components by infrared radiation. The utility model has the characteristics of fast heating, energy saving and stable operation. But because the printed circuit board and various components because of the material, the color of different infrared radiation heat absorption rate differences, resulting in various printed circuit boards of different components, and between different areas of the same element exists the phenomenon of uneven temperature.
Full blast: full air hot reflow is a method of heating a heated welding element by convection, jet nozzle, or heat resisting fan. The gas temperature of heating printed circuit board components close t
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