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三维集成电路堆叠硅通孔动态功耗优化董刚武文珊杨银堂-物理学报
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Stack-through silicon via dynamic power
consumption optimization in three-
dimensional integrated circuit
Article in Acta Physica Sinica -Chinese Edition- · January 201
DOI: 10.7498/aps.64.026601
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三维集成电路堆叠硅通孔动态功耗优化
董刚 武文珊 杨银堂
Stack-through silicon via dynamic power consumption optimization in three-dimensional integrated cir-
cuit
DongGang WuWen-Shan YangYin-Tang
引用信息Citation: ActaPhysicaSinica, ,026601(2015) DOI: 10.7498/aps.64.026601
在线阅读Viewonline: /10.7498/aps.64.026601
当期内容Viewtableofcontents: /CN/Y2015/V64/I2
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