废旧电路板低温改性实验研究.pdf

2 2 环境 工程 学报 V o l. 2, N o. 2 2 0 0 8 2 Ch inese Journal of Env ironm enta l Eng ineering Feb . 2 0 0 8 1 2 2 1 周翠红 陈茂和 潘永泰 钱 高 ( 1, 102617 2() , 100083) , , , - 30 , - 30 , - 30 , , , , , , - 30 - 40 , - 30 X705 A 167 39108( 2008) Study on lowtem peratrure m odification of printed circu it board 1 2 2 1 Zhou Cu ihong Chen M aohe P an Y ong ta i Q ian G ao ( 1. D epartm en t of Env ironm en tal E ng ineering, Be ijing In stitute of P ectrochem ical T echno logy, Beijing 1026 17 2. Sh cool of Ch em ical and Env ironm en tal Engineering, C h ina U n iv ersity ofM in ing and T echnology ( B eijing) , Beij ing 100083) Abs tract The com ponents and m ech anics intensity o f printed circu it board ( PCB) at room tem perature are introdu ced. Em phases are p laced on the study of low temp erature m odification o f PCB. It finds that mi pact streng th tends to decrease w ith coo ling tem perature and drops to a low est value at - 30 . A s for the bend ing streng th, it tends genera lly to firstly decrease and then increase, and at - 30 bending strength and fa ilure streng th a ll fall down to a m in mi um va lu e and then rise up aga in rap id ly. T hen the produ ct ion cap ac ity and pow er consum pt ion o f d ifferent cooling temp erature are studied. T he results show that cru sh PCB at low tem perature can increase produ ction cap ac ity and decrease pow er consumpt ion in a certain extent. U sing cryogenic grind ing the average pow er con sum