Hand Soldering Basics University of Colorado （手焊接基础知识科罗拉多大学）.pdf

HAND SOLDERING BASICS1 DAVID SLOAN, INTERNATIONAL SALES MANAGER LEO HUERTA, TECHNICAL SERVICES ENGINEER METCAL ABSTRACT Soldering quality and performance vary depending on tip geometry, board thickness, temperature, flux type, technique, etc. Everyday knowledge of soldering is not enough. This Technical Note outlines some basic rules of thumb that apply to all hand soldering operations. With the proper tools and techniques, productivity will increase, board quality and rework consistency will improve, and board damage will be kept to a minimum. This Technical Note discusses methods to improve daily soldering practices as well as methods to maintain your soldering tool tip life. PROCESS CONTROL To rework a PCB successfully with high quality standards, stringent process controls must be developed. Putting process controls in place will ensure that your results are consistent and repeatable. Once you have your process in place, you can be assured that your product¹s reliability will improve, productivity will increase, and scrap rate will decrease. Product reliability: Bad process control can lead to bad solder joints, damaged traces and vias, and thermal damage of the component. If the PCB is damaged, it will not meet quality standards, and it may fail in the field. Productivity: Good process control will increase your productivity. It makes your process more efficient, and cuts extraneous rework time from your operators schedule. Scrap Rate: Damaging boards wastes money and cuts back your output yield. Process Engineers can greatly increase quality by establishing standards for soldering processes. Metcal recommends the following generic process guid