Camea Module封装方式.ppt

Camera Module 封装方式 Prepared By：Kim Jin 内容大纲 常见封装方式 PLCC/CLCC（ Plastic/Ceramic Leaded Chip Carrier ） CSP（ Chip-Scale Package ） COB（Chip On Board） COF（Chip On Fpcb） FLIP CHIP（芯片倒装） Camera Module常见封装方式 Single Chip Solution (ISP embedded type) 1) Module assembly using with prepackaged plastic or ceramic unit CONNECTOR LENS HOLDER FPC (CIS + ISP) CHIP PCB Prepackaged Ceramic unit LENS ASS’Y IR CUT FILTER PASSIVE STIFFENER Camera Module常见封装方式 Single Chip Solution (ISP embedded type) 2) Module assembly using with prepackaged Glass CSP unit CONNECTOR LENS HOLDER FPC Prepackaged Glass CSP unit PASSIVE STIFFENER LENS ASS’Y IR CUT FILTER STIFFENER Camera Module常见封装方式 Single Chip Solution (ISP embedded type) 3) Module assembly using with Chip On Board (COB) CONNECTOR LENS HOLDER FPC WIRE PASSIVE DVC (CIS + ISP) CHIP LENS ASS’Y PCB IR CUT FILTER Camera Module常见封装方式 ACF Passive IR Filter CMOS CONNECTOR Single Chip Solution (ISP embedded type) 4) Module assembly using with Chip On FPC（COF） Camera Module常见封装方式 Single Chip Solution (ISP embedded type) 5) Module assembly using with flip-chip bonding technology CONNECTOR LENS HOLDER FPC PASSIVE DVC LENS ASS’Y SUBSTRATE IR CUT FILTER OR GLASS CIS CHIP ACF Camera Module常见封装方式 Single Chip Solution (ISP embedded type) 4) Module assembly using with chip stacking method CONNECTOR LENS HOLDER FPC WIRE PASSIVE DVC DSP CHIP LENS ASS’Y PCB IR CUT FILTER CIS CHIP Camera Module常见封装方式 Two Chip Solution (Image sensor DSP) 2) Module assembly using with DSP embedded PCB CONNECTOR LENS HOLDER FPC WIRE PASSIVE DVC DSP CHIP LENS ASS’Y PCB IR CUT FILTER CIS CHIP Camera Module常见封装方式 Two Chip Solution (Image sensor DSP) 3) Module assembly using with DSP on the back side CONNECTOR LENS HOLDER FPC WIRE PASSIVE DVC DSP CHIP LENS ASS’Y PCB IR CUT FILTER CIS CHIP Camera Module常见封装方式 Camera Module Design Process Structure for sample build Module Dimension Chip Information A. Video Format B. Pixel Size C. Image Area Size D. Image Area Posit