微处理器工艺及其电性能测试技术的研究毕业论文.doc

微处理器工艺及其电性能测试技术的研究毕业论文 目录 第一章 集成电路芯片概述··································3 1.1集成电路简介···············································3 1.1.1 集成电路的概念及分类··································3 1.1.2 集成电路的发展史······································3 1.1.3 我国半导体产业现状····································7 第二章 微处理器制造工艺技术······························9 2.1 材料及制备·················································9 2.11制备单晶硅·············································9 2.12晶圆工艺···············································10 2.2微处理器制造工艺展望·······································12 2.2.1 不断进步的工艺········································12 2.2.2 CPU制造前进方向·······································15 2.2.3晶体管的革命，Intel VS AMD 第三章 微处理器封装测试技术······························24 3.1 微处理器封装技术···········································24 3.1.1 封装的概念············································24 3.1.2微处理器封装技术及其分类······························24 第四章 微处理器电性能测试技术····························31 4.1微处理器电性能测试·········································31 4.1.1电性能测试的概念及作用································31 4.1.2电性能测试设备········································32 4.1.3电性能测试流程········································34 第五章 结论··············································40 参考文献··················································41 谢词······················································41 第一章 集成电路芯片概述 1.1集成电路简介 1.1.1 集成电路的概念及分类 集成电路（图1.1）是指半导体集成电路，即以半导体晶片材料为主，经加工制造，将无源元件、有源元件和互连线按照多层布线或遂道布线的方法将元器件组合成完整的电子电路 集成电路的分类 一、按电路功能分类 分为以门电路为基础的数字逻辑电路和以放大器为基础的线性电路，还有微波集成电路和光集成电路等。 二、按构成集成电路基础的晶体管分类 分为双极型集成电路和MOS型集成电路两大类。前者以双极型平面晶体管为主要器件；后者以MOS场效应晶体管为基础。 1、双极型电路 晶体管-晶体管逻辑（TTL）电路、高速发射极耦合逻辑（ECL）电路、高速低功耗肖特基晶体管-晶体管逻辑电路（SLTTL）及集成注入逻辑电路（I2L）等。 2、MOS型电路 N沟道MOS电路（NMOS）、P沟道MOS电路（PMOS）、互补MOS电路（CMOS）、(bi-CMOS) 及DMOS、VMOS电路等。 三．按用途分类 　　集成电路按用途可分为电视机用集成电路、音响用集成电路、影碟机用集成电路、录像机用集成电路、电脑（微机）用集成电路、电子琴用集成电路、通信用集成电路、路及各种专用集成电路。照相机用集成电路、遥控集成电路、语言集成电路、报警器用集成电 按应用领域分 集成电路按应用领域可分为标准通