大功率LED的封装及其散热基板研究-深圳大学.PDF

2007 2 28 1 李华平 等: 大功率 LED 的封装及其散热基板研究 LED 1, 2, 3 3 3 3 李华平 , 柴广跃 , 彭文达, 牛憨笨 ( 1. , 710068; 2. , 100864; 3. , 518060) : 从解决大功率发光二极管散热和材料热膨胀系数匹配的角度, 介绍了几种典 的封 装结构及金属芯线路板( MCPCB) 的性能, 并简要分析了其散热原理最后介绍了等离子微弧氧化 ( MA O) 工艺制作的铝芯金属线路板, 低成本低热阻性能稳定便于加工和进行多样结构的封装 是其突出优点对采用M A O 工艺的M CPCB 基板封装的瓦级单芯片 LED 进行了热场的有限元 模拟, 结果显示其热阻约为 10 K/ W; 当微弧氧化膜热导率由2 W # m- 1 # K- 1 升高到5 W # m- 1 # K- 1 时, 热阻将降至6 K/ W : LED; ; ; ; ; : T N252 : A : 1001- 5868( 2007) 01- 0047- 04 Package and MCPCB for igh-powerLEDs 1, 2, 3 3 3 3 L H ua-ping , CH A Guang-yue , P ENG Wen-da , N U H an- ben (1. XipanInstitute of Optics andPrecession Mechanics,Chinese Academy of Sciences, Xipan710068,C N; 2. Graduate School of ChineseAcademy of Sciences,Beijing 100864, C N; 3. Instituteof Optoelectronics,Shenzhen University, Shenzhen518060,C N) Abstract: From t he point of view of solv ing t he heat dissipat io n and t he m at ching betw een heat expansion co efficient s of t he mat erials for hig h pow er LEDs, t he package structure and the perf ormances of sev eral ty pes of m et al co re print ed circuit board ( M CPCB) have been pr esent ed in det ail as w ell as a brief analy sis on t he co ncept io n of heat dissipasion. A special MCP CB fabricat ed by plasma electr olyt e ox idation ( PEO) is intro duced, w hich is charact er ized by low cost , goo d electrical iso lat ion, excellent t hermal transf er and it s convenience fo r package pro cesses . And f init e elem ent m et hod ( FEM ) has