入门级专业英文词汇课件.ppt

PCB入 门 级 专 业 英 语 词 汇;物料篇;Solder mask/Solder resist ink 阻焊油墨 Thermosetting type ink 热固化油墨 Silkscreen/Component mark/Legend 字符 Solder, Tin/Lead solder 焊料,铅锡焊料 Drill bit, Rout bit /milling cutter 钻咀,锣刀,铣刀 Chemical 化学的 Dry film 干膜,是一种能感光,显像,抗电镀,抗蚀刻之阻剂 TG (Temperature of Glass Transition) 玻璃态转换温度 CTE( Coefficient of Thermal Expansion) 热膨胀系数 CTI( Comparative Tracking Index ) 相对漏电指数 Anti-CAF( conductive anodic filament ) 耐离子迁移 Dielectric constant 介电常数(DK/Er) TD( Temperature of Decompose) 热裂分解温度 RoHS( Restriction of Hazardous Substances Directive )危害性物质限制指令 (Lead铅 , Mercury汞 , Cadmium镉 , Chromium (VI)六价铬 , Polybrominated biphenyls ( PBB’s)多溴联苯, Polybrominated diphenyl ethers ( PBDE’s)多溴联苯醚) ;工艺篇;Solder mask printing 印阻焊 Exposure 曝光 UV cure UV固化(ultraviolet) LPI( Liquid Photo Image) 液体感光成像 Developing 显影 Silkscreen stencil 丝印钢网，简称丝网 Aluminum sheet 铝片 Scrubbing 磨边 DI water 纯水,去离子水( Deionization),由树脂对无物理大颗粒的水体进行阴阳离子的吸附,常见的有钙离子/氯离子/镁离子等 HASL (Hot Air Soldering Level) 喷锡,热风整平 LF-HASL (lead free-hot air soldering level) 无铅喷锡 ENIG/Immersion gold沉金(沉镍金, Electroless Nickel/Immersion Gold ) ENEPIG ( electroless nickel electroless palladium immersion gold )沉镍钯金 HDI( High Density Interconnector )高密度互连 ;Flash gold 水金(电薄金) Hard gold 厚金 Immersion Tin 沉锡 OSP / Entek (Organic Solderability Preservatives) 有机保焊剂,防氧化处理 Immersion silver 沉银 Pressing process 压合工艺 Brown oxidation 棕化 Layer up 叠层,预叠板 Lamination structure 压合结构 LASER (Light Amplification by Stimulated Emission of Radiation) 镭射 ,激光 Registration 对准，对位 ;OPE (Optiline Post Etch)內层蚀刻对位冲孔机 Rivet 铆钉/铆合 Fusion 热熔 X-ray, X射线 CCD( Charge Coupled Device ) 电荷耦合器件 X-Y dimension machine 二次元 Label, Barcode label 标签,条码标签 V-cut / V-score 刻槽 Rout 锣槽,锣板 Routing 布线(route的ing形式) ,也指锣槽,锣板 Punch 冲板/啤板 AOI (Automated Optical Inspection) 自动光学检查 Fly-probe test 飞针测试 Ultrasonic Cleaning 超声波清洗 Microetching 微蚀 Aspect Ratio 纵横比,厚径比,一般指板厚与最小孔孔径的比值;工程篇;Copper circuits 线路 Solder mask opening 阻焊开窗 Solder dam / solder mask bridge 阻焊桥 Thermal Via 导热孔,散热孔 Teardrop 泪滴 An