Software Environments for Embedded Systems课件.ppt

Lecture 26a:  Software Environmentsfor Embedded Systems;SW: Embedded Software Tools;Another View of Microprocessor Architecture;Fiddler’s Predictions for the Next Ten Years (2010);Fundamental Principles;What Will Be Embedded in Ten Years?;Embedded Microprocessor Evolution;680x0;A Challenging Environment;New Hardware Challenges Software Development;Embedded Software Crisis;SW: Embedded Software Tools;Outline on RTOS;Embedded Development: Generation 0;Embedded Development: Generation 1;Embedded Development: Generation 2;Embedded Development: Generation 3;Embedded Development: Generation 4;Embedded Development: Generation 5???;The RTOS Evolution;Introduction to RTOS;VxWorks;Supported Processors;Wind microkernel;Wind microkernel;Wind microkernel;``Board Support Package’’;VxMP;VxMP;VxFusion;pSOS;Supported processors;pSOS+ kernel;Board Support Package;pSOS+m kernel;eCos;Supported processors;Kernel;Hardware Abstraction Layer;Summary on RTOS;Recall the ``Board Support Package’’;Introduction to Device Drivers;Proliferation of Interfaces;Leads to Proliferation of Device Drivers;Device Driver Characterization;Device Characterization;I/O Processing Characteristics;Commercial Resources;Aysis 3DE DriveWay Features;DriveWay Design Methodology;K.B. Database;DriveWay Builder;About the code generator (1);About the code generator (2);CoWare Interface Synthesis?;Processor;SW: Embedded Software Tools;ASIC Value Proposition;The Importance of Code Size;SW Compiler Value Proposition;Memory? StrongARM Processor;Compiler Support;Current Status on Compiler Support;Recall: Architectural Features of DSPs;Example: IXP1200;IXP1200 Network Processor;Summary;ASIP/Extensible micro DESIGN FLOW;Tensilica TIE Overview;Tensilica TIE Design Cycle;Conclusions