磁控溅射法制备电磁屏蔽织物研究.pdf

真 　空 　科 　学 　与 　技 　术 　学 　报 第 27 卷 　第 3 期 　　　　　　　　　　　　 　　　　　　 264 CHINESE JOURNAL OF VACUUM SCIENCE AND TECHNOLOGY 2007 年 5 、6 月 　 磁控溅射法制备电磁屏蔽织物的研究 陈文兴 　杜莉娟 　姚玉元 　吕慎水 ( “先进纺织材料与制备技术”教育部重点实验室 ,浙江理工大学 　杭州 　310018) Electromagnetic Shielding Fabrics with Magnetron Sputtered Copper Coating Chen Wenxing ,Du Lijuan ,Yao Yuyuan and Lu Shenshui Key Laboratory of Advanced Textile Materials and Manufacturing Technology , Ministry of Education , Zhejiang SciTech University , Hangzhou 310018 , China 　　Abstract 　Copper films were coated on nonwoven fabrics by dc magnetron sputtering to fabricate electromagnetic shielding. The films ( ) ( ) were characterized with scanning electron microscopy SEM and atomic force microscopy AFM . The results show that the sputtering conditions significantly affect its deposition rate and its surface morphology. In the specified range ,as sputtering power increasess ,the deposition rate in creases and the film becomes increasingly compact with uniformly distributed copper grains. At a sputtering pressure of 09 Pa ,maximum depo sition rate can be obtained. Moreover ,the adhesion at the interface of copper films and fabrics is found to be fairly strong ,and the coating almost little affects the gas permeability. Our spectroscopic study shows that the fabrics display excellent electromagnetic shielding. 　　Keywords 　DC magnetron sputtering ,Atomic force microscopy , Surface resistance , Electromagnetic shi