单晶硅微尺度磨削材料去除过程试验研究程军.pdf

50 17 Vol.50 No.17 2 0 1 4 9 JOURNAL OF MECHANICAL ENGINEERING Sep. 2 0 1 4 DOI 10.3901/JME.2014.17.194 * 1 1 1 1 1 2 (1. 110004 2. 114000) TG161 Experimental Investigation on Material Removal Process for Micro-grinding of Single Crystal Silicon CHENG Jun1 WANG Chao1 WEN Xuelong1 YIN Guoqiang1 GONG Yadong1 SONG Hua2 (1. School of Mechanical Engineering and Automation, Northeastern University, Shenyang 110004; 2. School of Mechanical Engineering and Automation, University of Science and Technology Liaoning, Anshan 114000) Abstract Theoretical and experimental analysis on micro-grinding process of single crystal silicon has been investigated in this study. The mathematical model of undeformed chip thickness in slot micro-grinding of single crystal silicon has been built. Diamond tools in this experiment have been employed and slot micro-grinding experiments of single silicon are designed and carried out on a precise micro-machine tool. Influences of micro-grinding parameters to crack length are investigated from analysis of experiment results, the relationships between micro-grinding parameters to surface roughness and micro-grinding force during experiment have been revealed. The relationship between undeformed chip thickness and micro-grinding force results is built, it is found from experiment that the grinding force would increase with the decrease of undeformed chip thickness when the undefromed chip thickness is below lattice constant. It would provide research theory and experimental reference of material removal mechanism in micro-grinding of single crystal silicon. Key words micro-grinding single crys