波峰焊接工艺（Wave soldering process）.doc

波峰焊接工艺（Wave soldering process） Wave soldering process of electronic component Welding process plays an important role in the assembly of electronic components. It involves the performance, reliability and quality of the product, and even affects every subsequent process step. In addition, due to the rapid development of electronic components towards the light, thin and small, put forward a series of problems, the welding process for all manufacturers of electronic manufacturing industry launched a fierce competition around the SMT welding technology, to further improve the quality of welding, welding to overcome existed in short circuit, bridge, solder ball and leakage defects such as welding, so as to improve the quality of products, to meet the market demand. At present, the most widely used welding processes are wave crest welding and reflow soldering. The wave soldering process is mainly used for through hole and welding of various types of components, and it is a key group welding process. Although wave soldering has been developed for many years and will continue to be used, it will take time for us to use viable and viable wave soldering processes. Because this process must achieve rapid, high productivity and reasonable cost requirements. In other words, this with the welding process before each process step is closely related, including capital investment, PCB design, component solderability, assembly operations, flux selection, temperature / time control, solder and crystal structure etc.. 1 solder wave soldering, at present, the most commonly used solder is eutectic tin lead alloy tin lead: 63%; 37%, should grasp the solder pot temperature solder, the temperature should be higher than the temperature of the liquid alloy is 183 DEG C, and the temperature uniformity. In the past, the temperature of solder pot at 250 degrees was considered standard. With the innovation of solder technology, the uniformity of solder temperature in the solder pot has been cont