电路实验焊接技术(Circuit experiment welding technology).doc

电路实验焊接技术(Circuit experiment welding technology).doc

  1. 1、本文档共15页,可阅读全部内容。
  2. 2、有哪些信誉好的足球投注网站(book118)网站文档一经付费(服务费),不意味着购买了该文档的版权,仅供个人/单位学习、研究之用,不得用于商业用途,未经授权,严禁复制、发行、汇编、翻译或者网络传播等,侵权必究。
  3. 3、本站所有内容均由合作方或网友上传,本站不对文档的完整性、权威性及其观点立场正确性做任何保证或承诺!文档内容仅供研究参考,付费前请自行鉴别。如您付费,意味着您自己接受本站规则且自行承担风险,本站不退款、不进行额外附加服务;查看《如何避免下载的几个坑》。如果您已付费下载过本站文档,您可以点击 这里二次下载
  4. 4、如文档侵犯商业秘密、侵犯著作权、侵犯人身权等,请点击“版权申诉”(推荐),也可以打举报电话:400-050-0827(电话支持时间:9:00-18:30)。
查看更多
电路实验焊接技术(Circuit experiment welding technology)

电路实验焊接技术(Circuit experiment welding technology) This article is contributed by Mao Yuhan Ppt documents may experience poor browsing on the WAP side. It is recommended that you first select TXT, or download the source file to the local view. welding technique In the process of product design, it is often necessary to make circuit debugging experiments, which requires electrical and electronic technicians to master welding technology. Basic knowledge of welding 1. welding concept and classification Welding is the use of heat or pressure or both and other means, with or without filling materials, the separation of the two parts of the metal, with the help of diffusion atoms and interaction between atoms, and the formation of a permanent connection process. A junction formed by welding is called a solder joint. According to the state of the metal and the characteristics of the welding process, the welding methods can be divided into three categories: fusion welding, pressure welding and brazing. Brazing is divided into brazing and soldering according to the melting point of the solder. The solder whose melting point is higher than 450 degrees is called brazing, and the solder whose melting point is lower than 450 degrees is called soldering soldering. The 2. mechanism is actually the process of soldering soldering solder, solder, welding in welding heating under the effect of physical and chemical processes that occur between the different metal surface mutual infiltration, diffusion, combined with the final form of multi organizational layer. The mechanism can be expressed by soldering crystallization and solidification infiltration, diffusion and interfacial layer three process. Wettability is generally expressed by wetting angle theta, and the wetting angle is the angle between the tangent of the solder outer circle and the weld face at the junction of the weldment surface. When theta 90 degrees are solder non wetted weldment, theta =90 degrees is poor wetting perfor

文档评论(0)

jgx3536 + 关注
实名认证
内容提供者

该用户很懒,什么也没介绍

版权声明书
用户编号:6111134150000003

1亿VIP精品文档

相关文档