Lab reliability 可靠性测试.ppt

Reliability Test(可靠性測試) Kinds of Reliability Test (可靠性測試的種類) Precon Test(Preconditioning Test) 预处理测试 Reliability Test 可靠性测试 T/C Test(Temperature Cycling Test)温度周期测试 T/S Test(Thermal Shock Test) 热冲击测试(迅速冷热交替) HTST(High Temperature Storage Test) 高温仓测试（可以置于空气或者氮气柜中） TH Test(Temperature Humidity Test) 温度及湿度测试（水环境,腐蚀，电解质置换Au. A.基板铜层可能short,pad Al腐蚀；b.第一bond点断开） PCT(Pressure Cooker Test) 高压锅测试（饱和蒸汽，100%RH,主要用于QFP产品） HAST(Highly Accelerated Stress Test) 高加速应力测试 （不饱和蒸汽，80%RH,主要用于BGA产品） Psi 磅/平方英寸 英制压力 1Psi=6.89x10^3pa 1Pa=10^5bar=145x10^6psi I. Preconditioning Test(預處理測試) To know the workability of Semiconductor devices after soldering. 知道焊接后半导体元件的可使用性 It simulates delivery from assembly house to customers plant and soldering on PCB. 模拟从封装厂到客户处的运输及在线路板上的焊接 Procedure of Precon Test 预处理的程序 Moisture Sensitivity Levels 水分灵敏度 Defects after Precon Test 预处理后的故障 Defects after Precon Test预处理后的失效 II. Reliability Test 可靠性测试 Procedure of Reliability Test 可靠性测试的程序 Temperature Cycling test温度周期测试 Temperature Cycle Test 温度周期测试 Effects of T/C Test 影响温度周期的因素 Failures after T/C Test 温度周期测试后的失效 Open Failure after T/C Test 温度周期测试后的断路 2. Thermal Shock Test热冲击测试 3. High Temp Storage Test高温仓测试 High Temperature Storage Test高温仓测试 Effect of HTST影响高温仓测试的因素 Open Failure after HTST高温仓测试后的开路 4. Temperature Humidity(TH) Test温度及湿度测试 Temperature Humidity Test 温度及湿度测试 Effect of TH Test影响温度及湿度测试的因素 Failure after TH Test温度及湿度测试后的失效 5. Pressure Cooker Test(PCT)高压锅测试 Pressure Cooker Test高压锅测试 Effect of Pressure Cooker Test影响高压锅测试的因素 Aluminum bonding pad corrosion failure can be occur by the moisture which was penetrated through a gap between EMC and Lead Frame. 穿过EMC和lead frame缝隙的水分可以造成铝的bonding pad腐蚀 This corrosion can makes open failure. 腐蚀可能引起开路 Pad Corrosion by PCT高压锅测试造成的Pad腐蚀 6. Highly Accelerated Stress Test(HAST)高压锅测试 HAST高压锅测试 * Purpose of Precon Test (預處理測試的目的) EX