Studies on various chiponfilm (COF) packages （研究各种chiponfilm(咖啡)包）.pdf

Microelectronics Reliability 52 (2012) 1182–1188 Contents lists available at SciVerse ScienceDirect Microelectronics Reliability journal homepage: /lo cate/microrel Studies on various chip-on-film (COF) packages using ultra fine pitch two-metal layer flexible printed circuits (two-metal layer FPCs) Kyoung-Lim Suk a, Kyosung Choo b, Sung Jin Kim b, Jong-Soo Kim c, Kyung-Wook Paik a,⇑ a Department of Materials Science and Engineering, KAIST, 335 Gwahak-Ro Yuseong-Gu, Daejeon 305-701, Republic of Korea b Department of Mechanical Engineering, KAIST, 335 Gwahak-Ro Yuseong-Gu, Daejeon 305-701, Republic of Korea c STEMCO, Ochang Scientific Industrial Complex, 1111-4 Namchon-ri, Oksan-Myun, Cheongwon-gun, ChungCheng Buk-do 363-911, Republic of Korea a r t i c l e i n f o a b s t r a c t Article history: Various fine pitch chip-on-film (COF) packages assembled by (1) anisotropic conductive film (ACF), (2) Received 12 April 2011 nonconductive film (NCF), and (3) AuSn metallurgical bonding methods using fine pitch flexible printed Received in revised form 2 December 2011 circuits (FPCs) with two-metal layers were investigated in terms of electrical characteristics, flip chip Accepted 19 December 2011 joint properties, peel adhesion strength, heat dissipation capability, and reliability. Two-metal layer FPCs Available online 27 January 2012 and display driver IC (DDI) chips with 35 lm, 25 lm, and 20 lm pitch were prepared. All the COF pack- ages using two-metal lay