Thermal Issues of 3D ICs SEMATECH（3 d ICs SEMATECH热的问题）.pdf

Thermal Issues of 3D ICs T. Fukushima, T. Tanaka and M. Koyanagi Tohoku University, Japan Department of Bioengineering and Robotics Outline 1. Background 2. 3D Integration Technology in Tohoku University 3. Thermal Characteristics Evaluation of 3D LSI by Simulation and Experiments 4. Summary Advantages of 3D Integration Technology 1. Short interconnect length 5. Parallel processing 2. High packing density 6. New functionality 3. High-speed operation 7. New applications 4. Low power consumption System LSI Plan view Cross- sectional Functional view Vertical Sync. block interconnect clock length: 1-50μm Partition of functional Short total wiring length blocks Big concerns: Long wiring Replaced by vertical Global wiring interconnections Conventional 2D LSI 3D stacked LSI Cross-Sectional Structure of 3D LSI 3D Technology Based on Wafer-to-Wafer Bonding in Tohoku University Completed LSI wafers with TSVs 3D LSI Wafer-to-wafer bonding Wafer thinning First Proposal of Wafer-to-Wafer Bonding Technique (1989) 3D Projects in Tohoku Univ. (Koyanagi Group)