制程用冷却水pcw-节约能源园区.PPT

Page number 台積六廠節能措施簡介 台積六廠節能措施簡介 Fab-6 is the first of the six fabs TSMC plans to establish in the Tainan Science Industrial Park(TSIP). Fab-6 broke ground in July 1997 and started production in January 2000. Capacity 50,000 pcs of 8-inch wafer and 4,500 pcs of 12-inch wafer per month Technology Advanced CMOS technology ranging from 0.25μm down to 0.10μm. Featuring state-of-the-art manufacturing capabilities of all-scanner lithography, shallow trench isolation, Titanium/Cobalt Salicide, chemical mechanical polishing, low-k dielectrics, and copper interconnect. Product Mix Digital logic products, mixed-signal logic products, standard and embedded memory products. Clean Room Mini-environment: Class 0.1 Ballroom: Class 100 Key Milestones 07/‘97 Fab-6 Ground-Breaking Ceremony The first fab in Tainan Science-based Industrial Park 09/’97 Pilling Start More than three thousands of RC piles were drilled into ground 25 meter deep to reach bedrock. 02/’98 Erection of Steel Structure 10/’99 Process Tools Move In The most advanced 0.25~0.10 micron semiconductor technology 12/’99 Successful Pilot of 0.25 and 0.22 μm Products 01/’00 Production Start 06/’00 Achieved the First 10K Wafers Output 07/’00 Release 0.18um to Full Production 12/’00 Achieved 30K Wafers Output 節約能源措施 建廠設計階段 1.儲冰式空調系統 2.冰水主機熱回收系統 3. 5oC 及 9oC 之雙冰水溫度系統 4.潔淨室採 mini-environment 節能設計 5.空調系統,排氣系統及製程用水系統,皆使用變頻空制器 6.水資源回收 7.辦公室及停車場空調節能改善 生產運轉階段 1.製程用冷卻水(pcw)減量 2.潔淨室調整正壓及風速設定節能改善 3.製程排氣減量 4.降低冷卻水塔散熱風扇的負載 5.照明減量節能改善 90年度節能計劃 1.增加一台酸性洗滌塔，降低整座風管系統壓損 節省電能 2.高階製程廢水AOR / AWR回收 3.晶片乾燥槽廢水Maragoni Dryer 回收 4.化學機械研磨廢水回收 CMP recovery Fab-6 Fab-14 六廠介紹 ………………….1~3 節約能源措施 建廠設計階段