薄膜力学7-断裂1.pdf

EM 397: Thin Film Mechanics VII. Introduction to Fracture in Thin Films Nanshu Lu The University of Texas at Austin Fall 2013 Tension-induced cracking Film  Substrate debonding • Film subjected to a high tensile stress • Cracks nucleate at the surface defects • Multiple cracks can nucleate and propagate simultaneously Channel cracks Cross section: Top view: Courtesy of Jun He of Intel Corp. Fracture of low-k dielectrics OSG Silicon Tsui et al., J. Mater. Res. 20 , 2266-2273 (2005). Passivation films on metal interconnects Top view: Edge view: Courtesy of J.B. Han of Agilent SiN film on Al after thermal cycles Huang, Suo, Ma, J. Mech. Phys. Solids 50, 1079 (2002) Technologies, Singapore. Hard films on soft substrates Cracks G S D TFT island 500 nm Al film on Kepton substrate a-Si on polymer substrate (Courtesy of Z. Suo of Harvard Univ.) Gleskova, Wagner, Suo, Appl. Phys. Lett. , 75, 3011 (1999) Mud cracks 10 m 10 m Slickhorn Gulch, San Juan 1m SiN on Si River