无铅低温锡膏L23-BLT5 (技术资料--SnBi共晶系BL T5-英文版).pdf

SMIC Confidential Technical report SnBi Low temp Pb-free SnBi Low temp Pb-free SnBi Low temp Pb-free Eco-solder paste BLT5 Eco-solder paste Eco-solder paste BLT5 BLT5 SENJU Metal Industry Co.,Ltd Pb Pb Research Development Technical center SMIC Confidential Feature of SnBi eutectic alloySMT industrial method Advantage It is possible to heat in the low temperature.(It is results having in the camera module.) The width of melted temperature is narrow.Fig-1 The low temperature has results since the past. Heat cycle level is equal to the M705 composition. Fig-2 The elongation improves by the Ag addition. (L23 compositionFig-3 6 Problem The anxiety is in heatproof (Melting point 139) The oxidation speed is fast Fig-4 There is no solder for the correction. It is inferior to the dropping impact When the warp speed is fast The melting point descends greatly by Pb mixing. Fig-5 Feature of BLT5 Flux Flux type General print type / No clean type / RMA type Feature The generation of the solder ball is a little. p913 The generation of the capillary solder ball is a little. p14 Good wet-ability to Ni plate. p14 Void is few. p14 Steady use for a long time is possibleuntil 24hrp913 Directions Heating condition Fig-7 The leaving time after it prints is within four hours. The use of the automatic stir device : short (It is within at minutes).