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无铅低温锡膏L23-BLT5 (技术资料--SnBi共晶系BL T5-英文版)
SMIC Confidential
Technical report
SnBi Low temp Pb-free
SnBi Low temp Pb-free
SnBi Low temp Pb-free
Eco-solder paste BLT5
Eco-solder paste
Eco-solder paste BLT5
BLT5
SENJU Metal Industry Co.,Ltd Pb
Pb
Research Development Technical center
SMIC Confidential
Feature of SnBi eutectic alloySMT industrial method
Advantage It is possible to heat in the low temperature.(It is results having in the camera module.)
The width of melted temperature is narrow.Fig-1
The low temperature has results since the past.
Heat cycle level is equal to the M705 composition. Fig-2
The elongation improves by the Ag addition. (L23 compositionFig-3 6
Problem The anxiety is in heatproof (Melting point 139)
The oxidation speed is fast Fig-4
There is no solder for the correction.
It is inferior to the dropping impact When the warp speed is fast
The melting point descends greatly by Pb mixing. Fig-5
Feature of BLT5 Flux
Flux type General print type / No clean type / RMA type
Feature The generation of the solder ball is a little. p913
The generation of the capillary solder ball is a little. p14
Good wet-ability to Ni plate. p14
Void is few. p14
Steady use for a long time is possibleuntil 24hrp913
Directions
Heating condition Fig-7
The leaving time after it prints is within four hours.
The use of the automatic stir device : short (It is within at minutes).
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