- 1、本文档被系统程序自动判定探测到侵权嫌疑,本站暂时做下架处理。
- 2、如果您确认为侵权,可联系本站左侧在线QQ客服请求删除。我们会保证在24小时内做出处理,应急电话:400-050-0827。
- 3、此文档由网友上传,因疑似侵权的原因,本站不提供该文档下载,只提供部分内容试读。如果您是出版社/作者,看到后可认领文档,您也可以联系本站进行批量认领。
查看更多
Sn-30Bi-05Cu低温无铅钎料的微观组织及其力学-中国有色金属学报
19 10 2009 10
Vol.19 No.10 The Chinese Journal of Nonferrous Metals Oct. 2009
1004-0609(2009)10-1782-07
Sn-30Bi-0.5Cu
( 100088)
Sn-Bi Cu Sn-30Bi-0.5Cu
Cu Bi /Bi
Cu-Sn (Intermetallic compounds, IMC) Cu 0.5%()
IMC β-Sn
Sn-Bi Sn-Bi-Ag
Sn-30Bi-0.5Cu
Sn-Bi-Cu
TG 425 A
Microstructures and mechanical properties of
Sn-30Bi-0.5Cu low-temperature lead-free solder
ZHANG Fu-wen, XU Jun, HU Qiang, HE Hui-jun, WANG Zhi-gang
(Beijing COMPO Solder Co. Ltd., General Research Institute for Non-ferrous Metals, Beijing 100088, China)
Abstract: A new type of low-temperature solder, Sn-30Bi-0.5Cu was fabricated by adding Cu elements into the
tin-bismuth series solder. The microstructures and mechanical properties of the solder were studied. The results show that
the addition of Cu elements can restrain the segregation of bismuth in the interface between solder and Cu pad, prevent
the bismuth from forming into bulky crystal as strips, and in-situ form Cu-Sn intermetallic compounds(IMCs) in
tin-bismuth solder. When the mass fraction of Cu is about 0.5%, both of the tensile strength and elongation reach to the
best values, and the vibration reliability increases. The reason is that the addition of Cu element can improve the
microstructures of the Sn-Bi-Cu solder by forming appropriate rod-like shape fine IMC crack pinning and strengthening
β-Sn soft matrix, thus strengthening its soldering and vibration mechanical properties which are close to
您可能关注的文档
最近下载
- 2024年江苏省南京市中考物理试题卷(含答案解析).docx
- 八年级美术上册5静物画有声教案省公开课一等奖新名师优质课获奖PPT课件.pptx
- 电子鼓hd3中文说明书.pdf
- 2024年江苏省南京市中考数学试题卷(含答案解析).docx
- 通桥(2018)1301-Ⅲ时速250公里、350公里高速铁路无砟轨道(16+24+16)m钢筋混凝土刚构连续梁.pdf
- 2024年武汉市城市建设投资开发集团限公司招聘【221人】公开引进高层次人才和急需紧缺人才笔试参考题库(共500题)答案详解版.docx
- 12.《玩偶之家(节选)》课件 统编版高中语文选择性必修中册.pptx
- 眼部健康保养.ppt VIP
- 急性一氧化碳中毒诊治专家共识.pptx
- 心内科常见疾病护理常规ppt.pptx
文档评论(0)