BGA返工作業指導書.doc

AUTHORIZATIONS 核準: SIGNATURE _______________________________ 日期 DATE : ________________ DEPT. 簽名部門 : Engineering Department ( SMT ) SIGNATURE _______________________________ 日期 DATE : ________________ DEPT. 簽名部門 : Production Department ( SMT ) SIGNATURE _______________________________ 日期 DATE : ________________ DEPT. 簽名部門 : QA Department ( SMT ) Revision History 修訂記錄 Revision 版本 Date 日期 Description 修改內容 001 4 Jul 07 First Release  1. 目的 PURPOSE 1.1 This WI describes the general BGA rework process step procedures. 此工作指引製定BGA 一般維修程式。 2. 適用範圍 SCOPE 2.1 Applicable to all BGA products. 此程式適用於所有BGA 的產品。 3. 定義 DEFINITION 3.1 BGA – Ball Grid Array 4. 參考文件 REFERENCE DOCUMENT 4.1 QS-ME-087 ( ASIC 返工流程 / Rework ASIC Process Flow Chart ) 4.2 Acceptability of Printed-Board IPC-A-610 印刷板的可接受性 IPC-A-610 4.3 IPC 7711 standards (Rework of Electronic Assemblies ) IPC-7711 電子組裝件的返工 4.4 IPC 7721 standards ( Repair and modification of printed boards and Electronic assembles ) IPC-7721 印製板和電子組裝的修復與修正 4.5 Rework System APR5000 Operation Manual 維修系統機操作指引 5. 職責 RESPONSIBILITY 5.1 Engineer / Line leader is responsible to monitor and check the operators compliance per this Work instruction.工程師/組長負責監督維修工人按照此文件進行維修。 6. 設備及物料 EQUIPMENT AND MATERIAL 1. Paste flux 松香膏 8. Cleaning solvent 清潔劑 2. Rework System 維修系統 ( APR5000 ) 9. Soldering Iron 鉻鐵 3. Paste flux Stencil 松香膏鋼網 10. solder-suction wire 吸錫線 4. Solder Paste Stencil 錫漿膏鋼網 11. Solder Ball 鍚球 5. Reballing fixture and Stencil 12. Tweezers 鑷子 重植球夾具和鋼網 13. Finger cots 手指套 6. Wrist strap 防靜電腕帶 14. Microscope 顯微鏡 7. Dust free cleaning cloth 無塵布  7 BGA Rework Procedures BGA 維修程序 7.1 Rework System Setting 維修系統設定 - The following should be prepared and ch