导电胶互联工艺仿真分析.pdfVIP

摘 要 随着微电子制造业的飞速发展，电子元器件是往微型化、小型化、高度集成化和高 密度化的方向发展。导电胶作为一种新型的无铅焊接材料，互联的温度比较低，互联工 艺简单，方便操作，可以实现高的线分辨率，实现细间距的接合，提高实际生产的质量和 效率，节约生产成本。 然而诸多因素影响着导电胶的互联性能，由于元器件、胶体及电路基板的热膨胀系 数不匹配而导致胶体内部产生热应力，甚至导致胶体的热失效，所以残余应力分析是 体机械可靠性预测的基础。 本文首先介 了导电胶的组成、分类、作用和互联工艺过程等。其次用ANSYS软件建 立芯片与基板导电胶互联的模型，对导电胶残余应力进行仿真分析，分析影响导电胶互 联性能的主要工艺因素即温度、压力、时间对残余应力的影响；最后分析多因素耦合作 用对导电胶互联残余应力的影响，并设计了五因素二水平的正交试验表，总共有三十二 个组合，并对各因素因子组合进行了仿真分析，得到了同一因素不同水平对导电胶残余 应力的影响，以及不同因素对导电胶互联残余应力影响的大小程度和影响顺序。所得结 果对芯片与基板组装减小导电胶互联后残余应力提供理论依据，为各工艺参数及尺寸参 数的选择具有一定指导意义。 关键词：导电胶；互联工艺；残余应力；仿真分析 Conductive adhesive process simulation analysis of the Internet Student:LIANG Zhi-qiao Teacher:DAI Xuan-jun Abstract ：With the rapid development of microelectronics manufacturing, electronic components is toward miniaturization, the direction of miniaturization, high integration and high density. Conductive adhesive as a new type of lead-free welding material, interconnection of the temperature is lower, interconnection process is simple, convenient operation, can achieve high resolution of line, can realize the fine pitch joint, so as to improve the quality and efficiency of the process of production, saving the cost of production. However, many factors affect the conductive adhesive performance of the Internet, because components, colloid and substrate caused by thermal expansion coefficient mismatch thermal stress is generated in colloid led to the thermal failure of colloid, so the residual stress analysis is the foundation of the solder joint mechanical reliability prediction. This paper first introduces the composition, classification and function of the conductive adhesive, and Internet technology, etc. Second chip is established by using ANSYS software and the substrate conductive adhesive interconnection model, simulation analysis was made on the residual stress, analysis the main technological factors i