PCB印刷版术语.doc

转载——电路板(PCB)字汇整理PCB字典流程图PCB Mfg. FLOW CHARTUPDATED:1999,09,01多层板内层流程(INNER LAYER PRODUCT)多次埋孔Multiple Buried ViaJOHNNY HSU顾客(CUSTOMER)工程制前(FRONT-END DEP.)裁板(LAMINATE SHEAR)内层干膜(INNERLAYER IMAGE)预叠板及叠板(LAY- UP )通孔电镀(P . T . H .)液态防焊(LIQUID S/M )外观检查(VISUAL INSPECTION )成型(FINAL SHAPING)业务(SALES DEPARTMENT)生产管理(PM CONTROL)蚀铜(I/L ETCHING)钻孔(PTH DRILLING)压合(LAMINATION)外层干膜(OUTERLAYERIMAGE)二次铜及锡铅电镀(PATTERN PLATING)蚀铜(O/L ETCHING)检查(INSPECTION )喷锡(HOT AIR LEVELING)电测(ELECTRICAL TEST)出货前检查(O. Q. C. )包装出货(PACKINGSHIPPING)曝光(EXPOSURE)压膜(LAMINATION)前处理(PRELIMINARY TREATMENT )显影(DEVELOPIG)蚀铜(ETCHING)去膜(STRIPPING)黑化处理(BLACK OXIDE)烘烤(BAKING)预叠板及叠板(LAY- UP )压合(LAMINATION)后处理(POSTTREATMENT)曝光(EXPOSURE)压膜(LAMINATION)二次铜电镀(PATTERNPLATING)锡铅电镀(T/L PLATING)去膜(STRIPPING)蚀铜(ETCHING)剥锡铅(T/L STRIPPING)涂布印刷(S/M COATING)预干燥(PRE-CURE)曝光(EXPOSURE)显影(DEVELOPING)后烘烤(POST CURE)MLB全板电镀(PANEL PLATING)铜面防氧化处理O.S.P (Entek Cu 106A)外层制作(OUTER-LAYER)TENTING PROCESS镀金手指(G/F PLATING)镀化学镍金(E-less Ni/Au)For O. S. P.选择性镀镍镀金(SELECTIVE GOLD)印文字(SCREEN LEGEND)网版制作(STENCIL)图面(DRAWING)工作底片(WORKING A/W )制作规范(RUN CARD)程序带(PROGRAM )钻孔, 成型机(D. N. C.)底片(MASTER A/W)磁盘, 磁带(DISK , M/T)蓝图(DRAWING)资料传送(MODEM , FTP)A O I 检查(AOI INSPECTION )除胶渣(DESMER)通孔电镀(E-LESS CU)DOUBLE SIDE前处理(PRELIMINARY TREATMENT )全面镀镍金(S/G PLATING)雷射钻孔(LASER ABLATION)Blinded Via埋孔钻孔(I.V.H. DRILLING)埋孔钻孔(I.V.H. DRILLING)埋孔电镀(I.V.H. PLATING)埋孔电镀(I.V.H. PLATING)埋孔(Buried via)P1/136* Process Module 说明:A. 下料( Cut Lamination)a-1 裁板( Sheets Cutting)a-2 原物料发料(Panel)(Shear material to Size)B. 钻孔(Drilling)b-1 内钻(Inner Layer Drilling )b-2 一次孔(Outer Layer Drilling )b-3 二次孔(2nd Drilling)b-4 雷射钻孔(Laser Drilling )(Laser Ablation )b-5 盲(埋)孔钻孔(Blind Buried Hole Drilling)C. 干膜制程( Photo Process(D/F))c-1 前处理(Pretreatment)c-2 压膜(Dry Film Lamination)c-3 曝光(Exposure)c-4