一份非常好非常经典实用的SMT工艺文件.doc

Contents SHIPPING, STORAGE and PRODUCTION ENVIRONMENT 2 1.1 General shipping and storage conditions 2 1.2 Storage and handling conditions for solder paste 3 1.3 Storage and handling conditions for printed wiring boards [PWBs] 3 1.4 Storage conditions for underfill epoxy materials 4 1.5 Shelf life time for different component categories 5 1.5.1 Expired material handling 5 1.5.2 Moisture sensitivity levels 5 1.6 Drying (baking) moisture sensitive devices 6 1.6.1 Drying (baking) restrictions 6 1.7 Dry storage conditions 7 1.8 PASTE SPECIFICATIONS 7 2. STENCIL PRINTING PROCESS SPECIFICATIONS 8 2.1 Squeegee 8 2.2 Stencil 8 2.3 Support tables 9 2.4 Printing process parameters (stencil printing) 10 2.5 Print result validation 11 3. AUTOMATED OPTICAL INSPECTION, AOI 12 3.1 Location of the machine in the production line 12 3.2 Utilization of inspection results 12 3.3 Component and paste alarm limits 12 4. PLACEMENT PROCESS SPECIFICATIONS 13 4.1 Nozzles 13 4.2 Feeders 13 4.3 NC-Programs 13 4.4 Part Data / Vision processing 14 4.5 Placement process management data compatibility table 14 5. Reflow soldering profile measurement 15 5.1 Profile measurement equipment 15 5.2 Reflow profile measurement method 15 6. Standard, lead containing soldering process 16 6.1.1 Recommended reflow oven settings 17 7. Lead free soldering process 18 7.1 Reflow profile definition for Pb-free process 18 7.2 General Pb-free reflow soldering profile specification 19 7.3 Basic profile specification for standard calibration board in Pb-free process 20 7.4 Start-up settings for Pb-free process 21 7.5 Reflow profile measurement on product PWBs 22 8. UnderfiLl process 24 8.1 General 24 8.2 Dispensing pattern for CSP components 26 9. MANUAL SOLDERING PROCESS AND WORKMANSHIP CRITERIA 27 10. Specifications for visual inspection; error criteria, faults classification and training material 27 11. Related Documents 27 SHIPPING, STORAGE and PRODUCTION ENVIRONMENT Nokia Real Estate Services organization is resp