LCD制程与设备技术..ppt

* Solder 利用銲錫熔融接合，其接點電阻極低，由於接合密度不高，目前極少用於TAB和LCD面板之外引腳接合。 主要應用在TAB與PCB端的接合介面。 ACF Process for Glass ACF Attaching TCP Pre-Bonding TCP Main-Bonding ACF Process on PCB ACF Attaching PCB Pre-Bonding PCB Main-Bonding OLB技術關鍵點 LCD玻璃與外引腳的對位設計與精準度。 加熱頭和TCP的平行度及溫度傳遞效應。 製程時間、溫度、壓力。 TCP膨脹量之掌控。 Construction of ACF Attaching Cut unit Chuck unit Cell stage Bonding unit ACF tape supply unit Separate unit Cross Section of ACF Attaching Backup Cell stage Bonding head LCD cell ACF Cushion sheet Accuracy of ACF Attaching ΔL ΔW LCD lead ACF Specification of ACF Attaching Item Specification Panel size 1.4~4 inch ACF attaching length 4~100 mm ACF layer 2 layers/3 layers ACF width 1~3 mm ACF attachment accuracy ±0.2 mm (W) ±0.3 mm (L) Heating method Constant heating Bonding temperature RT~200 ℃, ±2 ℃ Load range 1~20 kgf Time setting 0.1~60 sec Tact time ≦ 15 sec/pcs Construction of TAB Pre-Bonding Backup Cell stage Bonding head LCD cell TCP TCP stage ACF Image processing unit Lead Configuration Lead Slippage ACF TCP lead LCD lead W L ΔL Specification of TAB Pre-Bonding Item Specification Panel size 1.4~4 inch TAB size 17?7~50?50 mm TAB lead pitch Min. 100 ?m TAB attachment accuracy X, Y ? ? 8 ?m CCD camera spacing 8~70 mm Heating method Constant heating Bonding temperature RT~200 ℃, ±2 ℃ Load range 1~20 kgf Time setting 0.1~60 sec Tact time ≦ 15 sec/pcs Construction of TAB Main-Bonding Backup Cell stage Bonding head LCD cell TCP ACF Cushion sheet Specification of TAB Main-Bonding Item Specification Panel size 1.4~4 inch TAB size 17?7~50?50 mm TAB attachment accuracy X, Y ? ? 15 ?m Heating method Constant heating Bonding temperature RT~400 ℃, ±2 ℃ Load range 15~160 kgf Time setting 0.1~60 sec Cushion material Silicon/Teflon, 2 layers Preheating temperature RT~110 ℃, ±2 ℃ Tact time ≦ 30 sec/pcs COG/COF製程設備技術 COG製程 COG設備 ACF Attaching Pre-bonding Main-bonding COF製程 COG示意圖 ITO Drive IC LCD Cell Bump ACF LCD Cell COG Processes Bump ACF Driver IC Display Glass IT