SMT回焊炉DOE实验.ppt

3. Process Parameter-Setting by DOE- overview (1) 3. Process Parameter-Setting by DOE- Reflow Process 3. Process Parameter-Setting by DOE- Reflow Process 3. Process Parameter-Setting DOE- Reflow Process 3. Process Parameter-Setting DOE- Reflow Process Confidential Contents 3. Reflow Soldering DOE Implementation 2. DOE----Execution Step 2. DOE----Execution Step Define the type of problem Select Factor and Level for DOE Select orthogonal table for Level combination and Run DOE Analyse DOE Data by ANOVA Decide what level of selected factors will be used Reproducibility Verification on selected combination Step 1 Step 2 Step 3 Step 4 Step 5 Step 6 Step 7 Step 8 Define the goal expected by DOE implementation Select typical product for DOE running Standardize DOE result into SOP Step 9 Step1. Define the type of problem As far as Pb-free soldering process is concerned, problem causes such as bridge, void are same as Pb soldering process, so basing on long-term experience in soldering industry, “A” type problem for Pb-free process optimization is selected. Step3. Select PCBA Type for DOE implementation Basing on the complexity of L1704 interface board PCBA-see photo1, its reflow process can be thought typical. Basing on the complexity of L1704 power board PCBA-see photo2 , its wave soldering process can be thought typical. Step2. Define the goal expected by DOE Photo1: L1704 Interface B For Typical Reflow Soldering Immersion Tin finish Photo2: L1704 Power B For Typical Wave Soldering OSP finish 3. Process Parameter-Setting by DOE- overview (2) Reflow Soldering DOE Implementation Step4. Select Factor and Level for DOE FB310 profile is selected since its max temperature is higher than others DOE Running background: Reflow Soldering Machine Model: FOLUNG NW-850N Conveyer speed: 60cm/min. Step5. Select orthogonal table for combination L827 and Run DOE Step6. Analyse DOE Data by ANOVA (1) Pareto of factor’s contribution to output Step6. Analyse DOE Data by