CUPROSTAR ST2000电镀铜添加剂.ppt

CUPROSTAR ST2000 Acid Copper Bath with Super Excellent Throwing Power Feature Excellent Throwing Power in Wide Range of Operation Condition Applicable for High Current Density Plating Suitable for High Aspect Ratio Through-hole Plating Very High Productivity Deposit with Excellent Ductility Deposit with Low Internal Stress Long-term Stability of Performance of the Bath Throwing Power of ST2000 Fixed Condition for the Test Throwing Power of ST2000 Throwing Power of ST2000 Throwing Power of ST2000 Comparison of Throwing Power Comparison of Plating Condition Physical Property of Deposit Copper Film with Thickness 40 – 60 μm Tensile Strength 30 – 35 kg/mm2 Elongation 15 – 25 % (prepared by Haring Cell) 24 – 30 % (prepared in Production Line) Physical Property of Deposit Physical Property of Deposit Stability of Performance Plating Condition (in Production Line) Stability of Performance Stability of Performance Make-up the Bath Dummy Plating at New Make-up Before addition of Additives 1.0 – 1.5 A/dm2 × 2 – 3 hours to remove impurities in the bath After addition of Additives Basically not necessary Plating Process Cleaning Water Rinse × 2 or 3 times Acid Activation Acid Copper Pretreatment Cleaner Compatibility of cleaner with our additives should be previously studied. Some of cleaners can cause copper deposition with tear drops around the through-holes. AKTIPUR AS can be recommended. 10 mL/L in acid copper bath does not influence the performance of plating. Plating Condition of Acid Copper Control Range of Acid Copper Bath Formulation of CUPROSTAR ST2000 Consumption Consumption should be surveyed in each bath. General Carrier component 100 mL/kAh Brightener component 25 – 30 mL/kAh After making-up Much more additives should be consumed. Replenishment General(After stabilization of the bath) ?Auto do