铜基无颗粒型导电墨水的性能研究-包装工程.PDFVIP

第38 卷 第 13 期 包 装 工 程 2017 年7 月 PACKAGING ENGINEERING ·113 · 铜基无颗粒型导电墨水的性能研究 金文君，冯晓龙，杨操，刘文涛，陈金周，黄灵阁 （郑州大学，郑州 450001 ） 摘要： 目的 通过测定导电涂层电阻率来确定导电墨水的最佳制备工艺参数。方法 以醋酸铜为前驱体， N,N-二甲基乙醇胺为络合剂，甲酸为还原剂，制备导电性高的铜基无颗粒型导电墨水。采用化学还原法 制备铜基无颗粒型导电墨水，通过正交实验研究烧结温度、烧结时间以及 Cu2+ ∶H+ ∶NH4+ 的比例对涂 层导电性的影响，确定最佳的制备工艺。结果 制备的铜基无颗粒型导电墨水在弱碱性环境下较稳定， 2+ + + 墨水中的Cu , H , NH4 的最佳物质的量之比为 1 ∶3 ∶3 。该配方的墨水具有很高的稳定性能和导电性 能，在玻璃基材上滴涂经160 ℃下热处理30 min ，得到的涂层电阻率仅为0.18 μΩ·m。结论 初步实现 了铜基无颗粒型导电墨水的低温烧结。 关键词：导电墨水；醋酸铜；无颗粒型；化学还原法；煅烧 中图分类号：TS802 文献标识码：A 文章编号： 1001-3563(2017)13-0113-05 Properties of Copper-based Particle-Free Conductive Ink JIN Wen-jun , FENG Xiao-long , YANG Cao, LIU Wen-tao , CHEN Jin-zhou, HUANG Ling-ge (Zhengzhou University, Zhengzhou 450001, China) ABSTRACT: The work aims to determine the best preparation process parameter of the conductive ink by measuring the resistivity of conductive coating. Taking copper acetate as precursor, N,N-Dimethylethanolamine as complexing agent, and formic acid as reductant, the copper-based particle-free conductive ink of high conductivity was prepared. Cop- per-based particle-free conductive ink was prepared in chemical reduction method. The influence of the sintered tempera- ture and time, and the ratio of Cu2+ ∶H+ ∶NH4+ on the coating conductivity was studied through orthogonal experiment to determine the best preparation process. The copper-based particle-free conductive ink with the optimal mole ratio of Cu2+ ∶H+ ∶NH4+ in the ink of 1 ∶3 ∶3 was stable in weak alkaline. The ink with optimal formu