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Thin Solid Films 647 (2018) 57–63
Contents lists available at ScienceDirect
Thin Solid Films
journal homepage: /locate/tsf
Fabrication of replica cliché with fine pattern using reverse offset printing T
process
a,b a b,⁎ a,⁎
Yejin Shin , Inyoung Kim , Dongho Oh , Taik-Min Lee
a Department of Printed Electronics, Korea Institute of Machinery Materials, 156, Gajeongbuk-ro, Yuseong-gu, Daejeon 34103, South Korea
b Mechanical Engineering, Chungnam National University, 99, Daehak-ro, Yuseong-gu, Daejeon 34134, South Korea
A R T I C L E I N F O A B S T R A C T
Keywords: Among the printing processes for printed electronic devices, the gravure offset and reverse offset methods have
Cliché drawn attention for their fine pattern printing potential. These printing methods use a cliché, which has a
Replica decisive effect on the precision and quality of the final product. In this research, a precise cliché replica method
Cliché replication is proposed. It consists of copper (Cu) sputtering, precise reverse offset printing with a 5-μm pattern width,
Reverse offset printing
nickel‑cobalt (Ni-Co) electroplating, rinsing, etching, and diamond-like carbon (DLC) coating. C
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