球格阵列构装BGA制程与可靠度分析-德霖技术学院图书馆.PDF

列(BGA) 度 年六 列 度 立料 列I/O度 良 良率 列力 異 料勞列行 列 勞度利更 參數 金更 金 勞裂 料 勞數 離 率 理論 行度了勞 列 勞 度 Manufacturing and Reliability Analysis of the Ball Grid Array Packages * ** Shiuan-Sheng Wang , Tung-Han Chuang * Department of Mechanical Engineering, De Lin Institute of Technology ** Department of Materials Science and Engineering, National Taiwan University Abstract Ball grid array (BGA) packages possess the advantages of high I/O density, good electrical properties, low cost and high yield rates. Since the fatigue mode of electronic packages during the temperature cycling test is material fatigue caused by the difference of thermal expansion coefficient. The studies including the manufacturing process and failure analysis, the prediction model of failure life for solder jo ints of BGA packages. In addition, using the electrical analysis for packaging modulus more direct information can be obtained. Accompanying with the metallographic observations, the intermetallics growth, microstructure change, crack nucleation and propagation of solder jo ints are investigated. Finally, the probability and statistics theory are employed to evaluate the reliability of the whole packaging system, which result in the clarification of failure life distribution and the prediction of failure life. Keywords: ball grid array, dynamic fatigue tests, electrical analysis, reliability. 259 年來 力不 度數 率率