非导电膜于智慧型标签与软性基板覆晶接合制程之研究II.PDF

行 精 類 行 年年 行 利 參理 理 利 年 年 非導電膜於智慧型標籤與軟性基板覆晶接合製程之研究(II) Study on RFID chip flip bonding to flex substrate using a non-conductive paste 計畫編號： NSC 96-2221-E-040-006 執行期間：96/08/01 - 97/07/31 計畫主持人：莊正利 中山醫學大學職業安全衛生學系 副教授 研究助理：陳韋豪 中正大學機械研究所 研究生 一、中文摘要 temperature/high humidity (HT/HH) test were conducted to examine the reliability of gold stud bumps bonded on copper electrodes. The environmental parameters for 本研究結合熱音波覆晶接合製程與非導電膠，將 reliability tests were complied with the JEDEC standards. 晶片覆晶接合於軟性基板之銅電極，對覆晶接合之試 After reliability tests, the peeling test and microstructure 片進行可靠度驗證，施以高溫儲存、溫度循環、高溫 observation for tested specimen were performed to evaluate the reliability. The bonding strength increased 蒸煮、恆溫恆溼等可靠度測試，期以加速元件失效速 with increasing the storage durations. After peeling test, 率，並由機械性剝離試驗量測晶片金凸塊與軟性基板 a gold bump with the copper film can be observed on the 銅電極之接合強度；以掃描式電子顯微鏡觀察其接合 fractured morphology of chip side, it indicates that bonding strength between gold