A new membrane electro-deposition based process for tin recovery from waste printed circuit boards文档.pdf

A new membrane electro-deposition based process for tin recovery from waste printed circuit boards文档.pdf

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A new membrane electro-deposition based process for tin recovery from waste printed circuit boards文档

Journal of Hazardous Materials 304 (2016) 409–416 Contents lists available at ScienceDirect Journal of Hazardous Materials j o u rn al h omepage: w w w. elsev /locate/jha z mat A new membrane electro-deposition based process for tin recovery from waste printed circuit boards Yang Jian-guang ∗ , Lei Jie, Peng Si-yao, Lv Yuan-lu, Shi Wei-qiang School of Metallurgy and Environment, Central South University, Changsha, Hunan 410083, China h i g h l i g h t s • A process for tin recovery based on membrane electro-deposition is proposed. • Tin can be recovered as the form of high purity cathode tin. • Anolyte can be reused as leaching agent for leaching tin again after electrowinning. • The optimum parameters for electro-deposition are introduced. a r t i c l e i n f o a b s t r a c t Article history: The current research investigated a process combining leaching, purification and membrane electrode- Received 30 August 2015 position to recover tin from the metal components of WPCBs. Experimental results showed that with Received in revised form 3 November 2015 a solid liquid ratio of 1:4, applying 1.1 times of stoichiometric SnCl4 dosage and HCl concentration of Accepted 5 November 2015 ◦ 3.5–4.0 mol/L at a temperature of 60–90 C, 99% of tin can be leached from the metal components of Available online 10 November 2015 WPCBs. The suitable purification conditions

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