The effect of mechanical–physical pretreatment on hydrometallurgical extraction of copper and tin in residue from printed circuit boards from used consumer equipment.pdf
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The effect of mechanical–physical pretreatment on hydrometallurgical extraction of copper and tin in residue from printed circuit boards from used consumer equipment
Minerals Engineering 65 (2014) 163–171
Contents lists available at ScienceDirect
Minerals Engineering
journal homepage: www.else /loc ate/mineng
The effect of mechanical–physical pretreatment on hydrometallurgical
extraction of copper and tin in residue from printed circuit boards from
used consumer equipment
Tomas Havlik a, Dusan Orac a,⇑, Mattias Berwanger b, Anja Maul b
a Technical University of Kosice, Faculty of Metallurgy, Department of Non-Ferrous Metals and Waste Treatment, Letna 9, 042 00 Kosice, Slovakia
b RWTH Aachen University, Department of Processing and Recycling, Wüllnerstr. 2, 52062 Aachen, Germany
a r t i c l e i n f o a b s t r a c t
Article history: This work is focused on studying mechanical–physical pretreatment of printed circuit boards from used
Received 27 December 2013 consumer equipment followed by extraction of copper and tin from residue fractions by leaching in
Accepted 8 June 2014 hydrochloric acid solutions. Mechanical–physical pretreatment was realized in three different proce-
Available online 5 July 2014
dures. Key processes were electro-dynamic separation, cross-flow air sifter separation and air table
separation, respectively. Leaching experiments were carried out in 1 M and 2 M HCl at 80 C. The results
Keywords: show that cross-flow air sifting leads to the highest accumulation of non-ferrous metals in a residue
Recycling
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