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IC工艺技术知识2-_光刻.ppt
Hitachi 8860 --- CD SEM Leitz Microscope inspect station Autoload UV inspection system 5.0 BCD 正胶工艺 Equipment SSI, SVG8800, SVG 90 Process step pre-bake/HMDS/cold plate spin (5000rpm) ---dynamic dispense ---top (bottom) side EBR(2mm) soft bake (100oC)/cold/palte Resist/spec Shipley 6112 (1.2u) 1818 (1.8u 1st metal) 6818 (2.4u 2nd metal) 6118 (2.9u Pad) 6124 (3.6u-4.5u ST) Everlight 533(1.2) Uniformity ---+ 300A Resist coating 升降机 冷板 HMDS 涂胶 热板 冷板 升降机 SVG 90 SVG 8800 5.1.1 Positive Resist (正胶) Component (成分) Resin (树脂) Diazonaphthoquinone(DNQ)/novolak Photo-sensitizer (感光剂) Solvent (溶剂) Dye (染料) Manufacturing (制造商) Kodak – Hunt – Ash chemical (USA) TOK (Japan) JSR (Japan) Shipley (USA) AZ (USA, Germany) Sumitomo (Japan) Everlight (Taiwan) 5.1.2 Positive Resist (正胶) Product Name and feature (产品称与特性) 以everlight (永光)正胶为例 Product Series EPG 510 Series Expose wavelength G-Line (435nm) Thickness Name 2000rpm 5000rpm Viscosity (粘度) EPG 510 --- 12 cp 1.25u 0.80u EPG 512 --- 21.5 cp 2.00u 1.25u EPG 516 --- 50 cp 3.25u 2.00u EPG 518 --- 105 cp 4.50u 2.75u EPG 519 --- 460 cp 9.00u 5.5u Resolution (分辨率) 0.8u (0.55u --- the smallest) Depth of Focus (聚焦深度)+ 1.4u (1.0u line/space) Sensitivity (感光度) Eth = 60 mj/cm2 Eop = 90 mj/cm2 5.1.4 Positive Resist (正胶) Select a positive resist 1. Resolution (分辨率) 2. Resist thickness --- Spin curve (厚度) 3. Photo speed (曝光速度) 4. Expose latitude (曝光宽容度) 5. Adhesion (粘附性) 6. Reflective notch (反射缺口) 6. Metallic content (金属含量) 7. Thermal stability (热稳定性) 8. Plasma resistance (抗腐蚀能力) 9. How easy to be removed (清除能力) 10. Price (價格) 5.2 Expose Equipment Ultratech stepper 1100 – (6”) Ultratech stepper 1500 – (6”) Canon 600 – (6”) Perkin Elmer 240 – (4”) Positive Resist reaction during expose Positive Resist reaction during expose 5.2.1 Ultratech Stepper Ultratech stepper G-line N/A
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