铜线封装可靠性研究-电子与通信工程专业论文.docx

rough diameter,requiringahighcurrentpowerdevices.Peoplefamiliar withandmasterthecoppcrprocess,aswellasthepriceofgoldhasbeenincreasing.SeverallargepackagingfactoryofTaiwanbegan itat2000..Thelatestartofthedomesticpackaging industry,since2008,graduallypackageofresearch and the introduction ofcopperproduction.Copper package,youcanmakethechipthecostofmaterialshasbeensignificantlyreduced.Wire costscan beaccounted foran average of30% ofthe costofthe entirepackage ofmaterialsfrom theoriginalisreduced to less than 5%.Controlconditions,without compromising performance,highquality products.Coppermass production process forcopper,we do allaspects ofassessmentand evaluation.The reliability ofthe copper isone ofthemost important content of assessment.This thesis has detailed andin-depthdiscussionsonreliabilityissuesforcopper,from thedetectionofcopperreliability invariousexperimentsto identifytheweakestlinkofthe copperreliability.Theoreticaland experimentalcombination ofselection and design ofthe experimentsofcopperreliability,used tomonitor the stability ofthe manufacturing process.Themark ofagoodgrasp ofcopperreliability，notonlyto enhancetheconficlenccinusandourcustomerswithcopperencapsulatedproducts,isalso responsible for the end customer.Makeschipsand electronicproductscontinue toreducethecostatthesametime,theirperformancedoesnotdec]ine,more cost-effective products.Keywords:Cu WirePackage reliabilityReliability experimentClassification Code:T N44第一章铜线封装可靠性研究背景1.1引线封装发展的趋势封装就是指把芯片的电路管脚，用导线方式连接到外部管脚以便在PCB(印制电路板)上和其他其他器件相连接。封装使得芯片和外界环境相隔绝，以防止外界环境对芯片造成腐烛或者其他不良影响，从而使得芯片可靠性得到提升。封装技术的好坏还直接影响到芯片自身性能的发挥和与之连接的PCB的设计和制造，因此它是至关重要的。封装中因为引线键合工艺实现简单、成本低廉、适用多种封装形式而在连接方式中占主导地位。传统量产应用最广泛的引线是金线。金线成本约占整个封装材料成本的1/3。黄金价格在最近十年内迅速升高(图])，近十年增加超过400% ，近五年增加超过200%，封装成本越来越高。整个芯片行业的竞争现在是越来越激烈，要求成本压力也越来越高。随着芯片的特征尺寸不断微缩，从0.5微米到 0.18微米，现在己经进入65纳米，22纳米的时代。裸芯的成本越来越低，而封装的成本因为物料，人工，产能等等原因没有办法同比例下降。这样使得进一步压缩芯片成本的空间落在封装上。用于封装的金线的不断涨价，我们不得不寻找一个其更加廉价的替代品…-铜线。，铜线价格如图2所示在近5年内都比较稳定。铜价折合每克0.05元，为金线的1/6000，价格优势明