铁氧体陶瓷无害金属化技术的研究-物理电子学专业论文.docx

浙江人学颂I：学位论文4、利用SEM等工具分析了最优金属化薄膜Cr(150nm)／Ni-Cu(460nm)／Ag(300nm)的表面形貌，断面结构，膜层结合与焊锡熔蚀情况，同时测试了其抗 拉强度和高温焊接性能，所制备的铁氧体金属化膜层其抗拉强度达到6．23MPa， 在450。C 10秒钟高温无铅焊料中的焊接良好率达100％，远高于电镀、化学镀等传统工艺的性能指标。5、研究了金属化薄膜在95％A1203陶瓷上的应用，探索出在95％A1203陶瓷 上的最佳膜系结构为Ti(100nm)／Ni—Cu(680nm)／Ag(300nm)，其抗拉强度和 焊接性能分别达12．21MPa和100％，同样高于传统工艺的性能指标，拓宽了该 技术的应用领域。6、在实验室基础上进行了产业化思考与研究，包括铁氧体磁芯掩膜模具的 设计，最利于产业化的膜层结构与厚度选择，以及连续式镀膜生产的设想等，为 该技术的产业化打下了一定的基础。关键词：铁氧体，金属化薄膜，磁控溅射，抗拉强度，高温焊接2浙江人学硕一{：学位论文AbstractWith the fast development of the electronic industry and the requirements of high electromagnetic compatibility,ferrite ceramic has been widely applied due to its high—frequency characteristic．As the crucial technique of the electronic ceramic production，metallization technology has become one of the most hot international research subjects．Magnetron sputtering can improve the metallization quality and reduce costs．Furthermore it Can solve the pollution problems of the traditional techniques，and reach the new EU environmental standards．All these advantages would make it to become a major field of the metallization．HoweveL only a few of researches have been conducted in this field and little breakthrough has been made SO far．Properties of metallization films and preparation techniques by sputtering were studied in this paper,and Cr／Ni—Cu／Ag films with better properties had been successfully prepared at room temperature．We also studied the influence factors of the film properties，the application of the film on 95％A1203 ceramic and the industrialization of this technology．The major work and innovation in this paper are as follows：1、Analysis the current developments and existing problems of the metallizationtechnology of ceramic through literature reading．Theoretical study suggests the main factors of the metallization quality are the film’S adhesion and internal stress．The filmstructure and sputtering parameters have a very serious impact on the adhesion andintemal stress．2、To solve the binding and high—temperature we