BGA 品质信赖度验证.pdf

7.0 QUALITY AND RELIABLITY Results from all stress tests are included within ENGINEERING PACKAGE this report. The evaluations performed for the certification included the following: CERTIFICATION • ° Infant Mortality 6.5V/+125 C 7.1 Introduction • Pre-conditioning IPC L-2 CSAM, Visual The µBGA package is a chip-scale package (CSP), which utilizes a polyimide tape with • High Voltage Dynamic Life Test (HVELT) ° eutectic solder balls. The µBGA package offers +125 C, 6.5V an application in smaller form factors with • ° allowable to use existing SMT infrastructure and High Temperature Storage (Bake) +140 C also have the testability of a packaged IC. • Temperature Cycle (T/C after pre- ° A thermosonic lead bond is used for the conditioning IPC L-2) –40 to +85 C interconnection between the die to polyimide • ° tape. A protective silicone elastomer compound Steam (autoclave) +121 C, 2 atm, 100%RH between the die and polyimide tape absorbs stresses due to thermal coefficient of expansion • Temper