大功率LED基本概念.ppt

High Power LED 定義 操作（消耗）功率：大於1W Ex:A01 當操作電流為350mA時， 電壓約為3.5V P=V(V) X I(A) = 3.5X0.35 = 1.23W High Power LED 結構 High Power與傳統LED封裝比較 High Power LED 效能提昇 * * Chip: Higher external efficiency chip (chip shape, surface roughness, photonic crystal,..) Flip chip Lens: Lambertian, Side emitting, Batwing Die attach: Higher thermal conductive silver paste Eutectic soldering, Metallic bonding Improvements: Chip efficiency Thermal management Light extraction efficiency Substrate: High thermal conductive ceramic substrate Metallic substrate, Diamond coatings Phosphor: Higher luminous phosphor, High efficiency phosphor coating, RGB tricolor phosphor Encapsulation: High refraction index materials, Excellent thermal stability Substrate Chip Encapsulation Lens Phosphor Die attach Size:7.0X6.0X1.75mm Color: White Red Green Blue Status: Mass production oC/W 17 All color Rj-L Thermal resistance (junction to heatsink) 3.5 G oK 5600 W Color temp. 10 B 3.5 W 3.5 B V 2.2 R VF Forward Voltage 470 B 525 G 624 R λD Dominant Wavelength nm deg 120 All color 2θ1/2 Viewing Angle 50 W 45 G lm 27 R ?V Luminous Flux Unit Typ. Color Symbol Parameter Electro-optical property (350mA DC, T ambient=25oC) Size: 8.0X8.0X5.7mm Color: White Red Green Blue oC/W 15 All color Rth Thermal resistance (junction to heatsink) 3.5 G oK 5600 W Color temp. 14 B 3.5 W 3.5 B V 2.2 R VF Forward Voltage 470 B 525 G 624 R λD Dominant Wavelength nm deg 120 All color 2θ1/2 Viewing Angle 55 W 55 G lm 35 R ?V Luminous Flux Unit Typ. Color Symbol Parameter Status: Mass production Electro-optical property (350mA DC, T ambient=25oC) Size: 8.0X8.0X5.7mm Color: White Red Green Blue oC/W 15 All color Rth Thermal resistance (junction to heatsink) 3.5 G oK 5600 W Color temp. 8 B 3.5 W 3.5 B V 2.2 R VF Forward Voltage 455 B 525 G 624 R λD Dominan