微电子封装提纲.doc

微电子封装技术 Chapter 1 Introduction 第1章 简介 1.The development characteristics and trends of microelectronics packaging. 微电子封装的发展特点和趋势。 2. The func tions of microelectronics packaging.。 3. The levels of microelectronics packaging technology. 微电子封装技术水平。 4. The methods for chip bonding. Chapter 2 Chip interconnection technology 第2章 芯片互连技术 It is one of the key chapters 它是一个关键的章节 1.The Three kinds of chip interconnection, and their characteristics and applications.。 2.The types of wire bonding (WB) technology, their characteristics and working principles. 。 3.The working principle and main process of the wire ball bonding. 。 4.The major materials for wire bonding. 用于引线键合的主要材料。 5.Tape automated bonding (TAB) technology: 带自动焊（TAB）的技术： 1 The characteristic and application of TAB technology. （TAB）的技术的特点和应用。 2 The key materials and technologies of TAB technology. （TAB）的技术。 3 The internal lead and outer lead welding technology of TAB technology. 内外引线焊接技术 6.Flip Chip Bonding (FCB) Technology .倒装焊(FCB) 技术 ?1 ）The characteristic and application of flip chip bonding technology 倒装焊接技术的特点和应用 2 UBM and multilayer metallization under chip bump ； UBM s structure and material, and the roles of each layer. UBM和多层金属化在芯片凹凸;UBM的结构和材料,每一层的角色。 3 ） The main fabrication metho d of chip bumps. 芯片凸点制作方法 4 FCB technology and its reliability. FCB技术和它的可靠性。 5 C4 soldering technology and its advantages. C4焊接技术和它的优点。 6 The role of underfill in FCB. 在FCB底部填充作用。 7 The interconnection principles for Isotropic and anisotropic conductive adhesive respectively. 分别为各向同性和各向异性导电胶互连原则。Chapter 3: Packaging technology of Through-Hole components 第3章：通孔元件封装技术 1.The classification of Through-Hole components. 通孔元件分类。 2.Focused on DIP packaging technology, including its process flow. 主要集中在封装技术，包括其工艺流程。 3.The characteristic s of PGA. PGA的特性 Chapter 4 Packaging technology of surface mounted device (SMD) 第4章 包装技术表面安装器件（SMD） 1.The advantages and disadvantages of SMD. 贴片的优点和缺点