BSOB process反打线说明3.pptVIP

ENGINEERING DEPARTMENT BSOB Bonding Process -- Step by step setting -- ASM EAGLE60 PURPOSE BSOB : bond stick on ball Multi-die bonding : Die to die bonding avoid the CAP’ mark on die surface and bond pad damage Ultra low loop bonding : GND to pad Lead contamination : Improve the 2nd bonding quality BSOB SAMPLE SEETING PROCESS 1. Teach a new bond program 2. Main menu 4 wire parameter 5 edit BSOB/BBOS bond 0 edit BSOB/BBOS bond N : normal bonding B : BSOB bonding S : BBOS bonding SEETING PROCESS 3. Main menu 3 parameter 0 bond parameter 7 EFO control 1 EFO setting 4 enable dual FAB SEETING PROCESS 4. Main menu 4 wire parameter 8 edit FAB control 1 edit standoff ball FAB setting the block : 1 SEETING PROCESS 5. Main menu 3 parameter 0 bond parameter 7 EFO control 0 EFO parameter 3 FAB block --- block “ 1 “ --- 6 ball size --- 7 ball thickness PARAMETER SEETING Main menu 3 parameter 1 base parameter B more 1 BSOB ball control 2 BSOB wire control PARAMETER SEETING BSOB ball control ball formation direction --- wiredir 植球时的CAP移动方向 Loop base / ball offset --- 4 50 植球时CAP的抬起量和移动量 Ball thickness --- 4 ball offset结束后的CAP’下降到的一个高度 Scrub distance --- 10 CAP’下降后的一个CAP移动量 Tail length --- 35 植完球后的TAIL长度 Time base ? --- 10 10 植球时的参数 Power base ? --- 35 10 Force base ? --- 20 15 Contact time ? --- 2 0 Contact power --- 20 0 Contact force --- 40 0 PARAMETER SEETING BSOB wire control 2nd bond PT offset