efd培训-最后一讲-FloEFD - 电子散热补充资料.ppt

* * * * * * Level 0: If no info about the package is available, use k=10 W/mK as dummy value for a package. Density= … . Specific heat capacity = …. Level 2: DELPHI models are not available (2008) Level 3: Detailed models must be created manually of eventually via FLOPACK - FLO-MCAD - Export * * The EL Module has to be purchased. To model IC package as a two-resistor component: create 2 rectangular bricks either as two parts or two solid bodies within a part, join the bricks together and put them on a plate, using Two-Resistor Component feature, point to case and junction bricks and select component’s characteristics (junction-to-case and junction-to-board thermal resistances) from the Engineering Database (if not exist you can easily create your characteristics), finally specify the power released at the component. A thermal resistance has a hidden underlying area dependence. You cannot apply a data sheet value of Rjc to a component with a smaller or greater footprint. That is, why a warning is issued, if the footprint of the geometric brick is in conflict with the library value of the 2R package. If there are just small discrepancies this can be ignored. * * The EL Module has to be purchased. * * The TEC object is currently part of the standard EFD product for compatibility with earlier EFD releases. Probably, in future, this feature is included only with the EFD: Electronics module, but the change has not yet been implemented in the general software release. * * The EL module has to be purchased. 1. Perforated Plate can be applied (only) at surface where Environment Boundary condition or Fan is specified. 2. Perforated Plate feature doesn’t affect flow direction, i.e. it doesn’t straighten flow approaching at an angle to the plate. That should be considered when perforated plate is applied to a fan or pressure condition with flow direction not perpendicular to the plate. * * The EL Module has to be purchased. The total electric current in no