PLASKON(故障排除)2003-08-13.pdf

Semiconductor Products 200 Technology Drive Alpharetta, GA 30005 770.475.6100 tel 678.442.1987 fax Cookson Electronics - Semiconductor Products produces an extensive line of PLASKON semiconductor epoxy molding compounds that meet the stringent quality requirements for encapsulation of electronic devices such as transistors, diodes, integrated circuits, and resistor networks. These products provide high reliability and excellent processability. Equipment used in the molding process is continually changing so that when a problem is encountered, the solution is not always readily apparent. Any of the following variables can affect the encapsulation process: • Mold Temperature Profile • Transfer Pressure • Transfer Ram Speed • Clamp Pressure • Preheat Time Temperature • Cure Time Temperature • Operator Technique • Material Variations • Material Handling Variations • Tooling Designs • Preform Quality The first step in preventing any molding problem is the use of proper molding techniques and maintenance. Sometimes, however, even with recommended molding techniques and mold maintenance, problems can still arise. This brochure presents Cooksons recommendations for molding techniques and mold maintenance as well as trouble- shooting for the prevention and solution of these molding problems. Section I.