smt工艺技术04(无铅元器件)新.pdf

Better For Business Better For The Environment 元器件/PCB控制技术 无铅元器件质量保证技术 中国赛宝实验室 罗 道 军 赛宝可靠性研究分析中心 Ceprei-R 元器件/PCB控制技术  表面组装元件  表面组装器件  PCB Ceprei-R 1.0 无铅元器件与PCB的定义 1. 物理性能满足无铅工艺的要求； 2. 构成元器件与PCB的各均质材料符合如下要求： RoHS 0.1wt%Pb JEIDA 0.1wt%Pb EUELVD 0.1wt%Pb Note: Solders with 85wt%Pb are exempted! Ceprei-R 1.1 元器件的标识 基本概念 IPC/JEDEC J-STD-609 Marking and Labeling of Components,PCBs and PCBAs to Identify Lead (Pb),Pb-Free and Other Attributes (代替IPC1066/JESD97 ） Ceprei-R 1.1.1 元器件标识的示例 This label shall be a minimum of 75 mm by 50 mm. Ceprei-R 1.1.2 可焊性涂层材料分类标识的标识方法示例 Note 1: If the Materials Category is used without a circle, ellipse, parentheses or underline, it must be made clear that the marking defines the category [e.g. ‘‘Category = e2’’, or ‘‘Solder = e2’’] Note 2: The letter ‘‘e’’ would be replaced with a ‘‘b’’ for identifying surface finish material listed in 5.2 for PCBs. Ceprei-R 1.1.3 元器件可焊性涂层材料分类标识 e0 – contains intentionally added lead (Pb) e1 – tin-silver-copper (SnAgCu) e2 – tin (Sn) alloys with no bismuth (Bi) nor zinc (Zn),excluding tin- silver-copper (SnAgCu) e3 – tin (Sn) e4 – precious metal [e.g., silver (Ag), gold (Au), nickelpalladium (NiPd), nickel-palladium-gold (NiPdAu) (no tin (Sn)] e5 – tin-zinc (SnZn), tin-zinc-other (SnZnX) [all other alloys