焊线动画-wirebonding新.ppt

pad lead pad lead pad lead pad lead pad lead pad lead pad lead pad lead Formation of a second bond pad lead heat Formation of a second bond pad lead heat heat pad lead heat heat pad lead heat heat pad lead pad lead pad lead pad lead pad lead pad lead pad lead Disconnection of the tail pad lead Disconnection of the tail pad lead Formation of a new free air ball WAFER MOUNT WAFER SAW DIE ATTACH EPOXY CURE WIRE BOND Semiconductor Packaging Process MODING Integrated Circuit (IC) TRIM / FORM WAFER CONTENTS A. PURPOSE B. PRINCIPLE C. PROCESS D. PACKAGE INTODUCE E. M/C BASIC DATA F. MATERIAL G. PARAMETER H. DEFECTS I. REFERENCE A.PURPOSE FORMING A STRONG AND RELIABLE INTERTALLIC BOND BETWWEEN THE WIRE AND THE PAD , AS WELL AS BETWEEN THE WIRE AND THE LEAD DICE GOLD WIRE LEADFRAME A.PURPOSE pad lead Gold wire Wedge Bond ( 2nd Bond ) Ball Bond ( 1st Bond ) B.PRINCIPLE HARD WELDING: PRESSURE AMPLIFY FREQUENCY WELDING TIME WELDING TEMPATURE THERMOSONIC BONDING: THERMAL COMPRESSURE ULTRASONIC ENERGY(1.2MHZ) GLASS CONTAMINATION VIBRATION SiO2, TiN, TiW Si GOLD BALL PRESSURE MOISTURE AL2O3 Al B.PRINCIPLE C. WIREBOND PROCESS pad lead Free air ball is captured in the chamfer GOLD BALL Free air ball is captured in the chamfer pad lead Free air ball is captured in the chamfer pad lead Free air ball is captured in the chamfer pad lead Free air ball is captured in the chamfer pad lead Formation of a first bond pad lead Formation of a first bond pad lead Formation of a first bond pad lead heat PRESSURE Ultra Sonic Vibration Formation of a first bond pad lead Ultra Sonic Vibration heat PRESSURE Capillary rises to loop height position pad lead Capillary rises to loop height position pad lead Capillary rises to loop height position pad lead Capillary rises to loop height position pad lead Capillary rises to loop height position pad lead Formation of a loop pad lead Formation of a loop pad lead pad lead pad lead pad lead pad lead pad lead pad le