《集成电路封装工艺的优化与未来发展》-毕业论文设计（学术).doc

PAGE 精品 精品 集成电路封装工艺的优化与未来发展 摘要:从80年代中后期开始电子产品正朝着、便携式，小型化、网络化和多媒体化方向发展，这种市场需求，对电路组装技术提出了相应的要求：单位体积信息的提高(高密度化)单位时间处理速度的提高(高速化)。为了满足这些要求，势必要提高电路组装的功能密度，这就成为了促进集成电路封装技术发展的最重要的因素。本文主要描述了集成电路封装工艺的发展历程；基本原理与优化；基本设备及结构以及其未来发展方向等有关内容。 关键字：集成电路；封装；优化；发展 IC packaging process optimization and future development LiMin (shaanxi defense industry institute of technology of profession of xian 710300) Abstract: from the mid 1980s began electronic products are heading, portable, miniaturization, networking and let alone these flatteries direction development, the market demand, the circuit assembly technologies puts forward corresponding requirement: the improvement of unit volume information (high density change) unit time processing speed of improving (high). In order to meet these requirements, will inevitably raise circuit assembly function density, and this would be to promote the development of integrated circuits encapsulation technology is the most important factor. This paper mainly describes the IC packaging technology development course, The basic principle and optimization, Basic equipment and structure and its future development trend of related content. Key word: IC；packaging；optimization；development 目录 TOC \o 1-3 \h \z \u HYPERLINK \l _Toc278911864 1引言 PAGEREF _Toc278911864 \h 1 HYPERLINK \l _Toc278911865 2封装技术概述 PAGEREF _Toc278911865 \h 3 HYPERLINK \l _Toc278911866 2.1封装的概念 PAGEREF _Toc278911866 \h 3 HYPERLINK \l _Toc278911867 2.2封装的作用 PAGEREF _Toc278911867 \h 3 HYPERLINK \l _Toc278911868 2.3封装的要求 PAGEREF _Toc278911868 \h 5 HYPERLINK \l _Toc278911869 2.4封装的地位 PAGEREF _Toc278911869 \h 5 HYPERLINK \l _Toc278911870 3集成电路的发展历程 PAGEREF _Toc278911870 \h 7 HYPERLINK \l _Toc278911871 3.1快过时的PDIP/SOP/QFP封装 PAGEREF _Toc278911871 \h 8 HYPERLINK \l _Toc278911872 3.2目前缓用的BGA/CSP/QFN封装 PAGEREF _Toc278911872 \h 9 HYPERLINK \l _Toc278911873 3.3以后的封装-MCM封装 PAGEREF _Toc278911873 \h 10 HYPERLINK \l _Toc278911874 4集成电路的封装形式 PAGEREF _Toc278911874 \h 12 HYPERLINK